Semiconductor Probe Materials
These precious metal alloys combine excellent hardness, straightness, and processability, serving as a critical conductive medium between test equipment and microchips.
Technical data
| Product: | Ag-Cu-Pd, Ag-Cu-Pd-Pt, Ag-Pd-Pt-Au-Cu-Zn, etc. | Shape: | Wire, element |
| Straightness: | Customizable | Performance: | Customized |
Features & Benefits
Enhanced Tribological Performance
A precisely balanced palladium-silver-copper (Pd-Ag-Cu) formulation with microalloying elements optimizes dislocation resistance and surface integrity, significantly extending probe service life under cyclic compression.
Excellent Straightness and Dimensional Stability
The material’s inherent straightness is critical for maintaining precise alignment with fine-pitch pads and preventing probe deflection in high-density testing.
Stable Electrical Conductivity
High silver content and a precious metal matrix deliver low and stable contact resistance, supporting accurate signal transmission and reduced measurement drift.
Good Processability
Available as wire and strip, the alloy offers excellent plastic working performance, supporting precision drawing and forming processes for manufacturing complex probe structures.
Oxidation and Corrosion Resistance
Precious metal components, such as Pd, form a stable surface state, resisting oxidation and reducing the risk of metal debris and probes sticking to fragile wafer pads.