Active Brazing Filler Metals
The reactive Ti element chemically bonds with ceramic surfaces (Al₂O₃, AlN, Si₃N₄) during brazing, eliminating costly MoMn metallization steps.
Technical data
| Product: | TAC (Ag-Cu-Ti), TAC/Cu, TAC/4J29 | Form: | Strip, wire, clad metal |
| Chemical composition: | Adjustable chemical composition | Performance: | Customized |
Features & Benefits
Direct Bonding to Ceramics
Chemically wets and reacts with Al₂O₃, AlN, Si₃N₄, zirconia (ZrO₂), and diamond/CBN, with no pre-metallization required.
Superior Joint Strength
Forms a dense reaction layer with mechanical strength and impact resistance superior to conventional Ag-Cu brazed joints.
Cost & Process Reduction
Eliminates expensive and time-consuming metallization/plating, simplifying the supply chain and lowering total cost.
Excellent Wetting & Void-free Seals
Ultra-strong spreadability yields hermetic, pore-free joints suitable for high-vacuum and pressure-tight applications.
Composite Design Flexibility (TAC/Cu, TAC/4J29)
Clad/composite designs cut material cost, improve heat dissipation, and match the coefficient of thermal expansion (CTE) to thick Cu plates or Kovar (4J29) fixtures.
