Clad Metal for High-power IGBT Modules
Optimized for SiC and IGBT power modules, these Al/Cu clad metals offer the fast thermal dissipation of aluminum alongside the solid electrical conductivity of copper, yielding lightweight busbars and baseplates for automated production.
Technical data
| Products: | Al/Cu, Al/C5191, Al/C19400 | Strip Thickness: | 0.015–1.5 mm |
| Strip Width: | 3–100 mm | Cladding Layer Thickness: | 0.001–70% of total thickness |
| Cladding Layer Width: | 1–100 mm | Cladding Layer Tolerance: | +20% to -10% of cladding layer thickness |
| Performance: | Customized |
Features & Benefits
Optimized Thermal Management
Features rapid thermal conduction through its aluminum layer coupled with current spreading via its copper/copper alloy layer, rendering it a viable alternative baseplate solution for SiC and IGBT modules.
Weight Reduction
The lightweight aluminum cladding layer serves as a replacement for solid copper or Kovar frames, a characteristic of critical importance for electric powertrain systems.
Automation Ready
Supplied in strips, the product addresses brazing preform alignment and supports automatic forming for busbars and lead frames.
CTE Stress Relief
The copper/bronze layer is engineered to match the coefficient of thermal expansion of ceramic substrates, while the aluminum layer bonds to cooling plates to balance stress during power cycling.
Material & Process Savings
Integrates electrical conduction and thermal spreading within a single monolithic structure, reducing the number of joining operations while lowering copper consumption and energy demand.
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