Clad Metal for Crystal Oscillator KV Rings
Developed to satisfy the strict requirements for high-reliability ceramic sealing, the AgCu15/4J29 KV ring clad metal for ceramic packaging has passed testing to meet relevant specification requirements. It is in mass production and serves as an alternative to imported materials.
Technical data
| Product: | AgCu15/4J29, AgCu28/4J29 | Strip Thickness: | 0.015–1.5 mm |
| Strip Width: | 3–100 mm | Cladding Layer Thickness: | 0.001–70% of total thickness |
| Cladding Layer Width: | 1–100 mm | Cladding Layer Tolerance: | +20% to -10% of cladding layer thickness |
| Performance: | Customized |
Features & Benefits
Material Definition
AgCu15/4J29 is a layered clad metal engineered specifically for ceramic-to-metal sealing.
Performance Advantage:
It combines the low CTE of 4J29 with the excellent brazing activity of AgCu15, making it ideal for semiconductor packaging.
Alignment Solution
Eliminates brazing preform misalignment during FET assembly, ensuring process precision.
Cost Efficiency
Enables automated production while effectively reduces material waste and overall manufacturing costs.
Application Scope
Delivers high-reliability components widely adopted in electro-vacuum devices and power modules.
